what are precautions for using COB light source

Different from the traditional SMD package, COB packaged LED is to package single or multiple chips directly on the aluminum substrate, which can enhance the heat dissipation performance of the LED. Due to the advantages of low thermal resistance, low assembly cost and excellent light uniformity of the COB package, it has been widely used in the lighting market. 

Precautions for the use of COB light source 

Static electricity:

This product is sensitive to static electricity, so effective protective measures must be taken when using this product. In particular, the high-voltage current generated by static electricity exceeds the maximum rating of the product, which may cause damage to the product, or may cause the product to fail completely. When customers use the product, they should take safe measures to prevent static electricity and surges. Grounding resistance is less than or equal to 10 ohms. The use of anti-static wristbands, anti-static mats, anti-static work clothes and work shoes, gloves and anti-static containers are all effective measures to prevent static electricity and surges. The soldering iron point should be properly grounded.

Soldering: 

Use a soldering iron for manual soldering: It is recommended to use a soldering iron less than 20W, and the temperature of the soldering iron must be kept no higher than 300℃, and the soldering time should not exceed 3 seconds. 

Reflow soldering: 

(a) It is recommended to set according to the temperature curve in the left picture. 

(B) After the soldering is completed and the temperature of the product drops to room temperature, take care to handle the product

Cleaning: 

After welding, it must be cleaned in accordance with the following conditions. 

Cleaning agent: isopropanol or industrial alcohol (above 95°) 

Temperature: 30 seconds up to 50°C or 3 minutes up to 30°C Ultrasonic cleaning: up to 300W

Other matters: 

Do not touch the colloidal part at any time, so as to avoid poor product surface or even failure